IC Package Designer | SI/PI Simulations 
-Experience in IC packaging design using Cadence APD+
-SI/PI simulations using Ansys SIWave, HFSS
-Designed PCBs using EasyEDA
-Worked on the characterization of a power module?s (IGBT half-bridge) stray inductance.
-Designed a MATLAB steady-state model of a novel PFC rectifier
-Experience using crucial laboratory skills with equipment, soldering etc
-Projects: 
        Design of Heatslug Flip-Chip BGA. 
        Design of Stacked-Die Wire-bond BGA