We  are looking for a Munich based IC Test Engineer for our customer in Munich, Germany

This opportunity requires an onsite presence at the customer's site at least 3 days per week, every week.
The role can be contract or contract to permanent.

**Must have working rights for Germany or EU.
**Candidates available on a remote basis only will not be considered

Responsibilities:
-Partner with design teams from early development stages to review DFX architecture and define comprehensive test requirements.
-Develop test methodologies and generate test content for high-speed embedded IP interfaces (LPDDR4/5, PCIe Gen4/5, MIPI D/C/MPHY).
-Perform test program development, pattern conversion, and pre-silicon validation (virtual simulations).
-Strong understanding of RF test principles and methodologies
-Support load board and probe card design.
-Lead post-silicon debug to enable timely delivery of samples to internal and external customers.
-Drive test characterization and optimization to meet automotive quality standards.
-Collaborate with Quality & Reliability teams to execute qualification plans efficiently.
-Lead production test deployment with tier-one foundries and OSATs for high-volume wafer sort and final test operations.

Requirements:
-BSc or MSc in Electrical Engineering.
-7+ years of experience in IC Product/Test Engineering.
-Proven hands-on experience in bring-up and productization of complex ICs.
-Experience with Teradyne UltraFlex/UltraFlexPlus would be a strong advantage.
-Deep knowledge of structural DFT methodologies (Scan, MBIST, JTAG).
-Proficiency in C/C++ and scripting (Python, Perl) in a Unix environment.
-Strong data and yield analysis skills using statistical tools (e.g., JMP).
-Familiarity with Verilog and RTL simulations would be an advantage.

If this role is a match to your skillset, please email me for more information amy.hardiman@chipright.com, along with your updated CV.