Modules: Amplifier, buffer, LDO, POR, charge pump, RF detector, bias, comparator, ADC, phase ADC, DAC, LNA, equalizer, Analog multiplexer, GMC filter etc. 
Technologies: CMOS 140nm SOI, TSMC 28nm, 55nm and 65nm, TowerJazz 130nm, Fujitsu 55nm. Projects: Audio amplifier, Image sensor, Bluetooth IP, RF transceiver (20GHz), Keyless entry system (Automotive).
Bandgap voltage reference design in 0.13µm CMOS
Top level hardware and software validation for image processing SoC.